Комунікативна практика. Під час розмови іноді виникає потреба вибачитись перед співбесідником

Вибачення

Під час розмови іноді виникає потреба вибачитись перед співбесідником. Для цього існує багато висловів, вибір яких залежить від конкретної ситуації. Декілька прикладів:

Sorry. I’m sorry. I’m very (awfully, extremely) sorry. I can’t tell you how sorry I am.

I feel sorry for …

Excuse me, I didn’t realize …

I hope you can excuse my …

Could I be excused from (…) today?

I just don’t know what to say …

Pardon me.

Well, pardon me for breathing (ironic). = Excuse me for living!

Forgive me, but …

На вибачення можна відповісти таким чином:

Oh, everything is OK (all right).

Don’t worry about that.

Oh, newer mind …

It doesn’t matter …

Exercise 1. Listen to the conversation and then answer the questions.

A: I’m sorry, I’m late. You know how the rush hour traffic is.

B: Well, I don’t know how to tell you, but I completely forgot about a book I promised you to bring. I was so busy last night …

A: Oh, don’t worry about that. You can bring it next time. But unfortunately I’ve got a real problem. Do you remember a calculator you lent me last month?

B: Yes.

A: I’m awfully sorry, but it seems to me that I’ve lost it. I’m trying to find it. Anyway I’ll buy you a new one.

B: Oh, that’s OK. That’s life. By the way it didn’t work properly sometimes. So it doesn’t really matter.

Who are the speakers?

Where are they?

How serious are the problems discussed?

What time is it now?

Why was one of the speakers late?

Вправи для самостійної роботи

Exercise 1. Translate the text into Ukrainian (Russian).

Once the photoresist is patterned, the wafer is ready for etching. During this step, photoresist remaining on the surface protects parts of the underlying layer from being removed by the acids or reactive gases used to etch the pattern on the surface of the wafer. After etching is complete, the protective layer of photoresist is removed to reveal electrically conducting or electrically insulating segments in the pattern determined by the mask.

Further masking and etching steps deposit patterns of additional materials on the chip. On each layer of material, masking and etching create a unique pattern of conducting and nonconducting areas. Together these patterns aligned on top of one another form the chip’s circuitry in a three-dimensional structure. But the circuitry needs fine-tuning to work properly. The tuning is provided by doping.

Doping deliberately adds chemical impurities, such as boron or arsenic, to parts of the silicon wafer to alter the type of conductivity in each doped area. Machines called ion implanters are often used to inject these impurities into the chip.

The material at the base of the chip is p-type silicon. One of the etching steps in the manufacture of a chip removes parts of the polysilicon and silicon dioxide layers put on the pure silicon base earlier, thus laying bare two strips of p-type silicon. Separating them is a strip that still bears its layer of conducting polysilicon; it is the transistor’s “gate.” The doping material now applied to the two strips of p-type silicon transforms them into n-type silicon. A positive charge applied to the gate attracts electrons below the gate in the transistor’s silicon base. These electrons create a channel between one n-type strip (the source) and the other (the drain). If a positive voltage is applied to the drain, current will flow from source to drain. In this mode, the transistor is “on.” A negative charge at the gate depletes the channel of electrons, thereby preventing the flow of current between source and drain. Now the transistor is “off.” It is by means of switching on and off that a transistor represents the arrays of 1 and 0 that constitute the binary code, the language of computers.

Done many times in many layers, these operations provide the chip with its multitude of transistors. The final step is interconnecting the transistors so they form an integrated circuit. This begins with further masking and etching operations that open a thin layer of electrical contacts between layers of the chip. Then aluminum is deposited and patterned using photolithography to create a form of wiring that links all the chip’s transistors.

This step completes the processing of the wafer. Now the individual chips are tested to ensure that all their electrical connections work using tiny electrical probes.

Exercise 2. Make notes about main advantages of contemporary electronics that seem to be the most important for world technical development and progress. What do you think about possible achievements in this field in the future? Prepare short oral reports (around 5 minutes) for these topics.

Lesson 8